The Richard Chu Award for Excellence in Thermal and Thermo-Mechanical Management of Electronics, formerly known as the ITherm Achievement Award was instituted in 1996 and presented in recognition of significant contributions made in thermal and thermo-mechanical aspects of electronics devices and systems. The Award has been re-named to honor late Richard Chu, the first recipient of the ITherm Achievement Award, and a seminal contributor to thermal management of electronics.
The Award, to be presented during the 2024 ITherm Conference includes a memento, a plaque, and a $1500 honorarium. Conference registration, and two nights of lodging will be complimentary. The recipient is expected to present an Invited Lecture on a topic of relevance to the conference themes.
2024 Winner – Ganesh Subbarayan
Ganesh Subbarayan is the James G. Dwyer Professor of Mechanical Engineering at Purdue University and the Co-Director of the Purdue-Binghamton SRC Center for Heterogeneous Integration Research in Packaging (CHIRP). He also serves as the Director of the recently created Atalla Institute for Advanced System Integration and Packaging (ASIP) at Purdue University. He began his professional career at IBM Corporation (1990-1993). He holds a B.Tech degree in Mechanical Engineering (1985) from the Indian Institute of Technology, Madras and a Direct Ph. D. (1991) in Mechanical Engineering from Cornell University. Dr. Subbarayan’s research is broadly concerned with modeling and experimentally characterizing failure in microelectronic devices and assemblies. He was a pioneer in using geometric models directly for analysis, popularly referred to as Isogeometric Analysis. Among others, Dr. Subbarayan received the 2022 SRC Technical Excellence Award, 2005 Excellence in Mechanics Award from the ASME Electronics and Photonics Packaging Division and the NSF CAREER award. He is a Fellow of ASME as well as IEEE, and he served as the Editor-in-Chief of IEEE Transactions on Advanced Packaging during 2002-2010.