We are pleased to let you know that the ITherm 2023 Final Program is now available!
Click here to download the program!
The final program includes technical paper presentation titles, detailed schedule of events at the conference, keynote, technology talk and panel abstracts and speaker bios, and other details for conference activities and events.
The conference will feature:
- 140+ Technical Paper Presentations in four tracks
- 3 Keynote Lectures given by Sandeep Ahuja (Intel), Steve Rickman (NASA) and Griselda Bonilla (IBM Research)
- 4 Technology Talks & 5 Panel Sessions covering a wide variety of topics including Heterogeneous Integration, Packaging Challenges, Additive Manufacturing, Sustainability and AI
- Research Workshop highlighting opportunities and outcomes from major federally funded research efforts
- 16 Professional Development Courses
- Student Poster and Networking Event featuring 52 student posters
- Heterogeneous Integration Roadmap (HIR) Session
- ASME K-16 and IEEE EPS Student Heatsink Design Competition
- ECTC/ITherm Diversity Panel
If you haven’t already done so, we invite you to register to participate in ITherm 2023, which will be held at the JW Marriott Orlando, Grande Lakes Resort in Orlando, Florida, USA, from May 30 to June 2, 2023. ITherm 2023 will be co-located with the 73rd Electronic Components and Technology Conference (ECTC 2023).
- Registration Information and Link — https://www.ieee-itherm.net/registration/
- Hotel Information and Reservations Link (availability now at Ritz-Carlton) — https://www.ieee-itherm.net/hotel-information/
