ITherm 2023

  • Professor Avram Bar-Cohen Best Papers
    • Component Level Thermal Management
      • Min Jong Kil (UCLA), Eythan Lam (UC – Santa Barbara), Mostafa Abuseada (UCLA), James F. Buckwalter (UC – Santa Barbara), Timothy S. Fisher (UCLA) “Direct Solar-Thermal Formation of Graphitic Heat Spreaders on Organic Substrates.”
    • System Level Thermal Management
      • Youngsang Cho, Heonwoo Kim, Kyoungmin Lee, Yunhyeok Im, Heeseok Lee, and Minkyu Kim “Thermal Aware Floorplan Optimization of SOC in Mobile Phone,” Samsung Electronics Co.
    • Mechanics & Reliability
      • Pranay P. Nagrani, Ritwik V. Kulkarni & Amy M. Marconnet, “Influence of Thermal Cycling on Degradation Behavior of Thermal Greases,” Purdue University.
    • Emerging Technologies & Fundamentals
      • Qian Qian (Purdue University), Xin Zhang (IBM Research), Shurong Tian (IBM “Experimental investigation of ultra-thin microchannel oscillating heat pipes with submillimeter-scale thickness ,” Purdue University.
  • Best Paper – Runner Up
    • Component Level Thermal Management
      • G. Elsinger (KU Leuven / imec), H. Oprins, V. Cherman (imec), G. Van der Plas (imec), E. Beyne(imec) & I. De Wolf (KU Leuven / imec), “Micro-Scale Jet Cooling: A Numerical Study on Improvement Options.”
    • System Level Thermal Management
      • Christopher D. Kim, Allison M. Orr and Amelia A. Cherian, “Bi-Modal Thermal Design of a Spacebourne Rotorcraft Avionics Unit,” Johns Hopkins Applied Physics Lab.
    • Mechanics and Reliability
      • Sai Sanjit Ganti, Ganesh Subbarayan, “Multiscale, Non-Intrusive Computational Framework for Analyzing Rate-Dependent Deformation of Solder Joints,” Purdue University.
    • Emerging Technologies & Fundamentals
      • Juvani Downer, Mehdi Kabir, Jiajun Xu, “ The Design and Development of a Smart Multilayer Coating with Variable Emissivity Capability for Space Vehicle Thermal Control Systems,” University of the District of Columbia.

ITherm 2022

  • Professor Avram Bar-Cohen Best Papers
    • Component Level Thermal Management
      • Amitav Tikadar, Yogendra Joshi, Satish Kumar, “Comparison between Direct Winding Heat Exchanger and Slot-liner Confined Evaporative Cooling of Electric Motor,” Georgia Institute of Technology.
    • System Level Thermal Management
      • Quianying Wu, Todd Salamon “Two-phase thermofluidic modeling and validation of a multi-zone microchannel evaporator,” Nokia Bell Laboratories and Stanford University
    • Mechanics and Reliability
      • Sudarshan Prasanna Prasad, Chetan Jois, Ganesh Subbarayan, “Novel Test Device for Non-destructive Experimental Characterization of Void Evolution in Microscale Solder Joints subjected to Thermal Aging,” Purdue University.
    • Emerging Technologies & Fundamentals
      • Lin Jiang, Anthony Dowling, Yu Liu, Ming-C. Cheng, “Chip-level Thermal Simulation for a Multicore Processor Using a Multi-Block Model Enabled by Proper Orthogonal Decomposition,” Clarkson University.
  • Best Paper – Runner Up
    • Component Level Thermal Management
      • Rahul Lall, Kamal Sikka, Isabel de Sousa, “Layered Unsupervised Learning-based Identification and Quantification of Voids in Package Thermal Interface Materials,” IBM Corporation.
    • System Level Thermal Management
      • Montse Vilarrubí, Desideri Regany, Francesc X. Majós, Manel Ibáñez, Joan I. Rosell, Josep Illa, Ferran Badia, Amrid Amnache, Éttienne Léveillé, Rajesh Pandiyan, Luc G. Fréchette, Jerome Barrau, “Numerical evaluation of bimetallic self-adaptive fins acting as flow disturbing elements inside a microchannel,” University of Lleida and Universal Smart Cooling S.L.
    • Mechanics and Reliability
      • Melina Lofrano, Bjorn Vermeersch, Herman Oprins, Seongho Park, Zsolt Tokei, “Impact of FEOL cross-heating on the thermal performance of advanced BEOL,” IMEC.
    • Emerging Technologies & Fundamentals
      • Gautier Rouaze, Jackson B. Marcinichen, John R. Thome, Kangning Xiong, L. Winston Zhang, “Pulsating Heat Pipe Fin Plates for Enhancing Natural and Forced Convection Cooling of Electronics: Experimental Campaign,” JJ Cooling Innovation Sàrl.

ITherm 2021

  • Best Papers
    • Component Level Thermal Management
      • Karthekeyan Sridhara, Vinod Narayanan, and Sushil Bhavnani, “Development of Microgravity Boiling Experiments aboard the International Space Station from Terrestrial Adverse Gravity Outcomes for a Ratcheted Microstructure with Engineered Nucleation Sites,” Auburn University and University of California – Davis, p317.
    • System Level Thermal Management
      • Prabhakar Subrahmanyam, Pooya Tadayon, Ying-Feng Pang, Arun Krishnamoorthy, and Amy Xia, “On the Thermal Efficiencies of Cascading Heat Exchangers: An Experimental Approach – I,” Intel Corporation, p382.
    • Mechanics and Reliability
      • Pradeep Lall, Tony Thomas, and Ken Blecker, “Prognostic and RUL Estimations of SAC105, SAC305, and SnPb Solders under Different Drop and Shock Loads using Long Short-Term Memory (LSTM) Deep Learning Technique,” Auburn University and US Army CDDC-AC, p255
    • Emerging Technologies & Fundamentals
      • Pradeep Lall, Jinesh Narangaparambila, Kyle Schulze, and Curtis Hill, “Process Recipes for Additively Printed Copper-Ink Flexible Circuits using Direct Write Methods,” Auburn University and NASA Marshall Space Flight Center, p231.
  • Best Paper – Runner Up
    • Component Level Thermal Management
      • Palash V Acharya, Manojkumar Lokanathan, Abdelhamid Ouroua, Robert Hebner, Shannon Strank, and Vaibhav Bahadur, “Assess the Impact of Novel Polymers and Thermal Management in a Power Electronics Module Using Machine Learning Approaches,” University of Texas at Austin and Army Research Lab South, p114.
    • System Level Thermal Management
      • Raffaele L. Amalfa, Francois P. Faraldo, Todd Salmon, Ryan Enright, Filippo Cataldo, Jackson B. Marcinichen, and John R. Thome, “Hybrid Two-Phase Cooling Technology for Next-Generation Servers: Thermal Performance Analysis,” Nokia Bell Labs, Provides Metalmeccanica S.r.l, and JJ Cooling Innovation, p285.
    • Mechanics and Reliability
      • Venkatesh Avula, Vanessa Smet, Yogendra Joshi, and Madhavan Swaminathan, “Augmented Finite Element Method (AFEM) for the Steady-State Thermal and Thermomechanical Analysis of Heterogeneous Integration Architectures,” Georgia Institute of Technology, p232.
    • Emerging Technologies & Fundamentals
      • Adam A Wilson, Darin Sharar, Jay R. Maddux, Michael Fish, and Ian Kierzewski, “Toward High-Throughput Thermal Characterization of Combinatorial Thin-Film Solid State Phase Change Materials,” US Army Research Laboratory and General Technical Services, p373.

ITherm 2019

  • Best Papers
    • Component Level Thermal Management
      • Piyas Chowdhury, Kamal Sikka, Alfred Grill, Dishit P. Parekh, “Optimal Filler Sizes for Thermal Interface Materials,” IBM.
    • System Level Thermal Management
      • Shurong Tian, Todd Takken, Mark Shultz, Chris Marroquin, Vic Mahaney, Yuan Yao, Michael J Ellsworth Jr, Anil Yuksel, Paul Coteus, “A Single Flexible Cold Plate Cools Multiple Devices,” IBM.
    • Mechanics and Reliability
      • Rainer Dudek, Kerstin Kreyssig, Sven Rzepka, Michael Novak, Wolfgang Gruebl, Peter Fruehauf, Andreas Weigert, “Comparisons of Solder Joints Fatigue Life Predictions and Several Long-Term Testing Results,” Fraunhofer ENAS Micro Materials Center, Continental, and Siemens.
    • Emerging Technologies & Fundamentals
      • Ziqi Yu, Zongqing Ren, Jaeho Lee, “Investigation of Thermal Metamaterials Based on Nanoporous Silicon Using Ray Tracing and Finite Element Simulations,” University of California – Irvine.
  • Outstanding Papers
    • Component Level Thermal Management
      • Prabhakar Subrahmanyam, Arun Krishnamoorthy, “Micro-Scale Nozzled Jet Heat Transfer Distributions and Flow Field Entrainment Effects Directly on Die,” Intel.
    • System Level Thermal Management
      • Anirudh Krishna, Jin Myung Kim, Juyoung Leem, Michael Cai Wang, SungWoo Nam Jaeho Lee, “Dynamic Radiative Thermal Management by Crumpled Graphene,” University of California – Irvine and University of Illinois at Urbana Champaign.
    • Mechanics and Reliability
      • A R Nazmus Sakib, Richard S Lai, Sandeep Shantaram, “Effects of Solder Mask Application Method on the Reliability of an Automotive Flip Chip PBGA Microcontroller,” NXP Semiconductors.
    • Emerging Technologies & Fundamentals (Tie)
      • Martinus Arie, David Hymas, Farah Singer, Amir Shooshtari, Michael Ohadi, “Performance Characterization of a Novel Cross-Media Composite Heat Exchanger for Air-to-Liquid Applications,” University of Maryland.
      • Aaditya Anand Candadai, Justin Weibel, Amy Marconnet, “A Measurement Technique for Thermal Conductivity Characterization of Ultra- High Molecular Weight Polyethylene Yarns Using High-Resolution Infrared Microscopy,” Purdue University.

ITherm 2018

  • Best Papers
    • Component Level Thermal Management
      • Joel D. Chapman, Peter A. Kottke, Andrei G. Fedorov, “Nanoelectrosprayed Liquid Jets for Evaporative Heat Transfer Enhancement,” Georgia Institute of Technology, p114.
    • System Level Thermal Management
      • Ying-Ju Yu and Carole-Jean Wu, “Designing a Temperature Model to Understand the Thermal Challenges of Portable Computing Platforms,” Arizona State University, p118.
    • Mechanics and Reliability
      • Bernhard Wunderle, Daniel May, Jens Heilmann, Joerg Arnold, Josef Hirscheider, Y. Li, Joerg Bauer, Mohamad Abo Ras, “A Novel Concept for Accelerated Stress Testing of Thermal Greases and In-situ Observation of Thermal Contact Degradation,” Chemnitz University of Technology, Fraunhofer IZM, Berliner Nanotest and Design GmbH, p170.
    • Emerging Technologies & Fundamentals
      • Quang N. Pham, Shiwei Zhang, Lin Cheng-Hui, Shuai Hao, and Yoonjin Won, “Boiling Heat Transfer Performance of Three-dimensionally Ordered Microporous Copper with Modulated Pore Diameters,” University of California – Irvine, p122.
  • Outstanding Papers
    • Component Level Thermal Management
      • Thomas Germain, Tanvir A. Chowdhury, Jake Carter, and Shawn A. Putnam, “Measuring Heat Transfer Coefficients for Microchannel Jet Impingement Using Time-Domain Thermoreflectance,” University of Central Florida, p269.
    • System Level Thermal Management
      • James W. VanGilder, Christopher M. Healey, Michael Condor, Wei Tian, Quentin Menusier, “A Compact Cooling-System Model for Transient Data Center Simulations,” Schneider Electric,p157.
    • Mechanics and Reliability
      • Pradeep Lall, Yihua Luo, Luu Nguyen, “A Novel Numerical Multiphysics Framework for the Modeling of Cu-Al Wire Bond Corrosion under HAST Conditions,” Auburn University and Texas Instruments, p330.
    • Emerging Technologies & Fundamentals
      • David B. Brown, Xufan Li, Kai Xiao, David B. Geohegan, Satish Kumar, “Thermal Boundary Conductance Mapping at Metal-MoSe 2 Interface,” Georgia Institute of Technology and Oak Ridge National Laboratory, p373.