Click here to download the Advance Program for ITherm 2025

In the Advance Program, you will find complete details of the keynotes, technical tracks, sessions, and papers. In addition to paper presentations and vendor exhibits, ITherm 2025 will include panel discussions, keynote lectures by prominent speakers, invited technology talks, ECTC/ITherm joint networking events and short courses, and a student design competition.

Advance Program highlights:

  • Over 180 Technical Papers and presentations organized across four Technical Tracks:
    • Component-Level Thermal Management (TI)
    • System-Level Thermal Management (TII)
    • Mechanics & Reliability (M)
    • Emerging Technologies & Fundamentals (E)
  • 3 Keynote Talks
    • Future of AI Hardware Enabled by Advanced Packaging (Raja Swaminathan, Corporate VP, AMD)
    • Accelerating the Energy Transition through Digital Engineering and Simulation (Scott Parent, VP and Field CTO, Ansys)
    • Data Center Energy Efficiency in a Post-Exascale Era (Cullen Bash, VP of R&D, HP Labs)
  • Richard Chu ITherm Award and Seminar
    • Energy and Thermal Management of Chips, Systems and Datacenters
      Necessitates a Return to Fundamentals
      Chandrakant D. Patel, HP Chief Engineer and Senior Fellow (retired)
  • 9 Technology-Talks providing deep-dive talks on high-profile topics
  • 4 Panels discussing the latest industry challenges and trends
  • 2 Panels discussing special interest topics
    • COOLERCHIPS Research Overview
    • Technology Transition: From Concept to Commercialization
  • 58 Student Posters showcasing the latest research in an interactive networking environment
  • ASME/K16 & IEEE/EPS Student Design Challenge Presentations
  • ECTC/ITherm Young Professional Networking Event
  • 2025 ECTC Student and Start-Up Innovation Challenge (open to ITherm delegates)
  • 16 Professional Development Courses offered as a collaboration with ECTC


We look forward to your participation in ITherm 2025!