2024 Poster Award Winners

Best OVERALL Poster

Assessment of Bubble Pump Model for Fluid Directional Motion From Asymmetric Heated Ratchets

G. Prudhvi Reddy, University of California Davis
(Prof. Vinod Narayanan)

Component-Level Thermal Management Track

BEST POSTERRUNNER-UP POSTER
Comparison between Direct Winding Heat Exchanger and Slot-liner Confined Evaporative Cooling of Electric MotorModeling of Backside Power Delivery and Thermal Management in
Semiconductor Die Packages
Ryan Regan, Purdue University
(Prof. Justin A. Weibel)		Zekun Wu, Purdue University
(Prof. Justin A. Weibel & Prof. Liang Pan)

SYSTEM-LEVEL Thermal Management Track

BEST POSTERRUNNER-UP POSTER
Novel Subcooled Boiling Chamber with Submerged Condensation for High Heat Flux Removal for Data Center ApplicationClosed-Loop Analysis of Thermal Energy Storage Device Arrangement in a Thermal Management System
Maharshi Shukla, Rochester Institute of Technology
(Prof. Satish G. Kandlikar)		Pandu Dewanatha and Demetrius Gulewicz,
Purdue University
(Prof. Neera Jain)

MECHANICS & RELIABILITY Track

BEST POSTERRUNNER-UP POSTER (TIE)
Predictive Damage Modeling at Potted Electronic Assemblies under High G Shock LoadsTemperature on the Reliability of Lead-Free Solder Joint Assemblies in Vibration
Aathi Pandurangan, Auburn University
(Prof. Pradeep Lall)		Vishal Mehta, Auburn University
(Prof. Pradeep Lall and Prof. Jeff Suhling)
Reliability of SAC305 Alloy in Drop Shock at Elevated Temperature
Palash Vyas, Auburn University
(Prof. Sa’d Hamasha)

EMERGING TECHNOLOGIES & FUNDAMENTALS TRACK

BEST POSTERRUNNER-UP POSTER (TIE)
Modification of Flow Boiling Regimes and Mechanisms in Near-Critical FlowsAdvancing Sustainability in Printed Electronics: Low Temperature Interconnects and Water-Based Ink Performance
Trevor Whitaker, University of Utah
(Prof. S. R. Rao)		Sabina Bimali, Auburn University
(Prof. Pradeep Lall)
Repairability Of Additively Printed Circuits Using Sustainable Aqueous-Based Silver Nanoparticle Ink on Polyimide Substrates
Daniel Karakitie, Auburn University
(Prof. Pradeep Lall)

2024 IEEE EPS/ASME K16 Student Additive Manufacturing Heat Sink Design Competition

WINNING TEAMRUNNER-UP TEAM
Crimson Peak
University of Utah		Team ETH
Eidgenössische Technische Hochschule Zürich

Prior Student Poster Award Winners

ITherm 2023

  • Best Overall Poster
    • Diego Vaca (Georgia Institute of Technology), “Temperature Dependent Thermal Properties of Thin Film Hafnium Oxide”
  • Best Posters
    • Component-Level Thermal Management
      • Carol Caceres (Villanova University),
    • System-Level Thermal Management
      • Falak Mandali (Purdue University), “Control Co-Design of a Thermal Management System
      • with Integrated Latent Thermal Energy Storage and a Logic-based Controller”
    • Mechanics & Reliability
      • Pranay P. Nagrani (Purdue University), “Influence of Thermal Cycling on Degradation Behavior of Thermal Greases”
    • Emerging Technologies & Fundamentals
      • Diego Vaca (Georgia Institute of Technology), “Temperature Dependent Thermal Properties of Thin Film Hafnium Oxide”
  • Outstanding Posters
    • Component-Level Thermal Management
      • Georg Elsinger (KU Leuven), “Micro-Scale Jet Cooling: A Numerical Study on Improvement Options”
    • System-Level Thermal Management
      • Joshua Palumbo (University of Toronto), “Implementation of a Topologically Optimized Heat Sink for Non-Uniform Heat Fluxes in an EV Fast-Charger”
      • Mechanics & Reliability
        • Ritwik Vijaykumar Kulkarni (Purdue University), “In situ Optical Observations of Degradation of Thermal Greases with Thermal Cycling”
      • Emerging Technologies & Fundamentals
        • Aalok Gaitonde (Purdue University), “Feasibility Assessment of Metrologies for Thermal Resistance Characterization of Deeply Buried Interfaces between Bonded Silicon Layers”

ITherm 2022

  • Best Overall Poster
    • Chetan Jois, Purdue University, “Phase Field Simulations of Solder Void Evolution under Thermal Aging”
  • Best Posters
    • Component-Level Thermal Management
      • Amitav Tikadar, Georgia Institute of Technology, “Comparison between Direct Winding Heat Exchanger and Slot-liner Confined Evaporative Cooling of Electric Motor”
    • System-Level Thermal Management
      • Tayler Shelly, Purdue University, “A Dynamic Co-Simulation Framework for the Analysis of Battery Electric Vehicle Thermal Management Systems”
    • Mechanics & Reliability
      • Chetan Jois, Purdue University, “Phase Field Simulations of Solder Void Evolution under Thermal Aging”
    • Emerging Technologies & Fundamentals
      • David Coenen, KU Leuven, “Circuit-level thermal modelling of Silicon Photonic Transceiver Array using Machine Learning”
  • Outstanding Posters
    • Component-Level Thermal Management
      • Aaron Smith, Auburn University, “Flow Visualization of Turbulent Jet Impingement with Engineered Surface Modifications through Particle Image Velocimetry”
    • System-Level Thermal Management
      • Veeresh Ayyagari, University of Maryland College Park, “Performance Characterization of a Novel Low-Cost Additively Manufactured PCM-to-Air Polymer Composite Thermal Energy Storage for Cooling Equipment Peak Load Shifting”
    • Mechanics & Reliability
      • Jinesh Narangaparambil, Auburn University, “Influence of Component Interconnect with Printed Copper Circuits on Realized Mechanical and Electrical Characteristics in FHE Applications”
    • Emerging Technologies & Fundamentals
      • Maureen Winter, Purdue University, “The Effect of Fin Array Height and Spacing on Heat Transfer Performance during Pool Boiling from Extended Surfaces”

ITherm 2021

  • Best Overall Poster
    • Venkatesh Avula, Georgia Institute of Technology “Augmented Finite Element Method (AFEM) for Steady-state Thermal and Thermomechanical Modeling Integration Architectures”
  • Best Posters
    • Component-Level Thermal Management
      • Meghavin Bhatasana, Purdue University “Optimization of an Embedded Phase Change Material Cooling Strategy Using Machine Learning”
    • System Level-Thermal Management
      • Achutha Tamraparni, Texas A&M University “Experimental Validation of Composite Phase Change Material Optimized for Thermal Energy Storage”
    • Mechanics and Reliability
      • Venkatesh Avula, Georgia Institute of Technology “Augmented Finite Element Method (AFEM) for Steady-state Thermal and Thermomechanical Modeling Integration Architectures”
    • Emerging Technologies & Fundamentals
      • Pranay Nagrani, Purdue University “Two-Fluid Modeling of Dense Particulate Suspensions for Electronics Cooling”
  • Outstanding Posters
    • Component-Level Thermal Management
      • Soumya Bandyopadhyay, Purdue University “Experimental Characterization of Cascaded Vapor Chambers for Spreading of Non-Uniform Heat Loads”
    • System-Level Thermal Management
      • Ujash Shah, UCLA “Segmented Thermal Management with Flash Cooling for Heterogeneous Wafer-Scale Systems”
    • Mechanics and Reliability
      • Padmanava, Auburn University “Effect of Surface Preparation and Cure-Parameters on the Interface Properties of Flexible Encapsulation in FHE Applications”
    • Emerging Technologies & Fundamentals
      • Saeel Shrivallabh Pai, Purdue University “A Machine-Learning-Based Surrogate Model for Internal Flow Nusselt Number and Friction Factor in Various Channel Cross Sections”

ITherm 2019

  • Best Overall Poster
    • Sinan Su, Auburn University “Effect of Surface Finish on The Fatigue Behavior of Bi-based Solder Joints”
  • Best Posters
    • Component Level-Thermal Management
      • Sevket Umut Yuruker, University of Maryland “A Metamodeling Approach for Optimization of Manifold Microchannel Systems for High Flux Cooling Applications”
    • System-Level Thermal Management
      • Reece Whitt, University of Arkansas “Heat Transfer And Pressure Drop Performance Of Additively Manufactured Plastic Heat Sinks For Low-Weight Directed Cooling Integration For Power Electronics”
    • Mechanics and Reliability
      • Jing Wu, Auburn University “Investigation of Aging Induced Microstructural Changes in Doped SAC+X Solders”
    • Emerging Technologies & Fundamentals
      • Aaditya Anand Candadai, Purdue University “A Measurement Technique for Thermal Conductivity Characterization of Ultra-High Molecular Weight Polyethylene Yarns Using High-Resolution Infrared Microscopy”
  • Outstanding Posters
    • Component-Level Thermal Management
      • Debraliz Isaac Aragones, Purdue University “Effect of Filler Configuration on the Effective Thermal Conductivity of Polymer Composites”.
    • System-Level Thermal Management
      • Zihao Yuan, Boston University “Two-Phase Cooling with Micropillar Evaporators: A New Approach to Remove Heat from Future High-Performance Chips”
    • Mechanics and Reliability
      • Ved Soni, Auburn University “Effect of Shallow Charging on Flexible Power Source Capacity Subjected to Varying C-Rates and Extreme Temperatures”
    • Emerging Technologies & Fundamentals
      • Patrick Krane, Purdue University “Identifying Hot Spots in Electronics Packages with a Sensitivity-Coefficient Based Inverse Heat Conduction Method”

ITherm 2018

  • Best Overall Poster
    • Kshitij Gupta, University of Toronto “Liquid Cooling Solutions for a High-frequency, Bi-directional, On-Board Electric Vehicle Power-hub”
  • Best Posters
    • Component-Level Thermal Management
      • Matthew Clark, Purdue University “Identification of the Dominant Heat Transfer Mechanisms During Confined Two-Phase Jet Impingement”
    • System-Level Thermal Management
      • Luke Yates, Georgia Institute of Technology “Electrical and Thermal Analysis of Vertical GaN-on-GaN P-N Diodes”
    • Mechanics and Reliability
      • Abdullah Fahim, Auburn University “Mechanical Characterization of Intermetallic Compounds in SAC Solder Joints at Elevated Temperatures”
    • Emerging Technologies & Fundamentals
      • Ivel Collins, Purdue University “Experimental Characterization of Microchannel Heat Sinks Made by Additive Manufacturing”
  • Outstanding Posters
    • Component-Level Thermal Management
      • Qingyang Wang, University of California, San Diego “High Heat Flux Boiling Heat Transfer Through Nanoporous Membranes”
    • System-Level Thermal Management
      • Jayati Athavale, Georgia Institute of Technology “Artificial Neural Network Based Prediction of Temperature and Flow Profile in Data Centers”
    • Mechanics and Reliability
      • Amrit Abrol, Auburn University “Flexible Power-Source Survivability Assurance under Bending Loads and Operating Temperatures Representative of Stresses of Daily Motion”
    • Emerging Technologies & Fundamentals
      • Georges Pavlidis, Georgia Institute of Technology “Improving the Transient Thermal Characterization of GaN HEMTs”

Past Student Design Competition Award Winners

ITherm 2023

  • Winners
    • Preston Bodily, Taylor Cox, Chandler Elliott, Zach Julien, Xander Lehnardt, University of Utah
  • Runners-up
    • Kai Wei, Marshall Allen, Mark Luke, Texas A&M University

ITherm 2022

  • Winners
    • Alexander Nicolai, Lisa Stencel, Diego Montalvo, Eike van Dieken, Technische Universität Berlin
  • Runners-up
    • Behzad Ahmadi, Kelsey Brinks, Masoud Ahmadi, Gracie Brownlow, Behnam Ahmadi, Michigan Technical University

ITherm 2019

  • David Saltzman, Andrew White, Evan Diewald, and Emma Veley of Pennsylvania State University