Component-Level Thermal Management Track

PROF. AVRAM BAR-COHEN BEST PAPERBEST PAPER – RUNNER UP
Automated Gimbaling of Conical Nozzles for Jet Vectoring Impingement Cooling to Mitigate Workload Dependent Hotspots in High Power Density SiliconAn Integrated Simulation Framework for Thermal-Mechanical Performance Analysis of Two-phase Microchannel Evaporators
Prabhakar Subrahmanyam, Sankarananda Basak, Vishnu P. Sugumar, Ying-Feng Pang, Arunkumar Krishnamoorthy & Mark Bianco (Intel Corporation)1Sarwesh N. Parbat, 1David J. Apigo, 2Haoyun Qiu, 2Pouya Kabirzadeh, 1Rishav Roy, 1Syed Faisal, 2Nenad Miljkovic, 1Todd Salamon (1Nokia Bell Labs., 2University of Illinois – Urbana-Champaign)
Development of a Hybrid Single/Two-phase Capillary-based Micro-cooler using Copper Inverse Opals Wick with Silicon 3D Manifold for High-Heat-Flux Cooling
1H. Kwon, 1Q. Wu, 1,2D. Kong, 1S. Hazra, 1K. Jiang, 1,3C. Ahn, 4S. Narumanchi, 2H. Lee, 5J. Palko, 6E. M. Dede, 1M. Asheghi, 1K. E. Goodson (1Stanford University, 2Chung-Ang University, 3Hyundai Motor Company, 4NREL, 5University of California – Merced, 6Toyota Research Institute of North America)
Thermal Characterization of Two-Phase Cooling using Embedded  Microchannels in a High Current Density Electric Motor
1Ryan Regan, 2Kimberly Saviers, 2Wenping Zhao, 2Andrzej Kuczek, 2Jagadeesh Tangudu, 1Justin A. Weibel (1Purdue University, 2RTRC)

SYSTEM-LEVEL Thermal Management Track

PROF. AVRAM BAR-COHEN BEST PAPERBEST PAPER – RUNNER UP
Ultrathin Blowers: A Study on Parameters Influencing Flow and Thermal Performance in Notebook ApplicationsAn Advanced 48U Single Phase Immersion Cooling System Design for Commercial Data Center Deployments
Ravishankar Srikanth, Amit Kumar, Arnab Sen (Intel Corporation)1Brant Chang, 1Jimmy Chang, 2Allen Liang, 2Jun Zhang, 2Carrie Chen, 2Jiahong Wu, 3Hu Tang, 3QingYi Kong (1Inventec Corporation, 2Intel Corporation, 3OPPO)
Design and Characterization of a Thermal Test Vehicle with Embedded Phase Change Material
Meghavin Bhatasana and Amy Marconnet (Purdue University)

MECHANICS & RELIABILITY Track

PROF. AVRAM BAR-COHEN BEST PAPERBEST PAPER – RUNNER UP
Accelerated Testing of Thermal Grease Degradation: Combined Thermal Gradients and Forced Mechanical CyclingInvestigation of the Effects of Sustained High-Temperature on the Reliability of Lead-Free Solder Joint Assemblies in Vibration
Pranay P. Nagrani & Amy M. Marconnet (Purdue University)1Pradeep Lall, 1Vishal Mehta, 1Jeff Suhling, 2David Locker (1Auburn University, 2US Army CCDC)

EMERGING TECHNOLOGIES & FUNDAMENTALS TRACK

PROF. AVRAM BAR-COHEN BEST PAPERBEST PAPER – RUNNER UP
Static and Dynamic Thermal Modelling of Si Photonic Thermo-Optic Phase ShifterCharacterization of Enhanced Two-Phase Jet Impingement on Femtosecond Laser Surface Processed (FLSP) Aluminum Surfaces
1David Coenen, 1Minkyu Kim, 1Herman Oprins, 1Kristof Croes,1Peter De Heyn, 1Joris Van Campenhout & 1,2Ingrid De Wolf (1imec, 2KU Leuven)1Alexander Ceperley, 1Gopinath Sahu, 2Andrew Reicks, 2Craig Zuhlke, 2George Gogos, 1Justin A. Weibel (1Purdue University, 2University of Nebraska – Lincoln)
Development and Performance Evaluation of  Additively Printed In-Mold-Electronic Sensors
1Pradeep Lall, 1Ved Soni, 2Scott Miller (1Auburn University, 2NextFlex)