Component-Level Thermal Management Track
| PROF. AVRAM BAR-COHEN BEST PAPER | BEST PAPER – RUNNER UP |
| Comparison between Direct Winding Heat Exchanger and Slot-liner Confined Evaporative Cooling of Electric Motor | Layered Unsupervised Learning-based Identification and Quantification of Voids in Package Thermal Interface Materials |
| Amitav Tikadar, Yogendra Joshi, Satish Kumar (Georgia Institute of Technology) | Rahul Lall, Kamal Sikka, Isabel De Sousa (IBM) |
SYSTEM-LEVEL Thermal Management Track
| PROF. AVRAM BAR-COHEN BEST PAPER | BEST PAPER – RUNNER UP |
| Two-phase thermofluidic modeling and validation of a multi-zone microchannel evaporator | Numerical evaluation of bimetallic self-adaptive fins acting as flow disturbing elements inside a microchannel |
| Qianying Wu (Nokia Bell Labs and Stanford University), Todd Salamon (Nokia Bell Labs) | Montse Vilarrubi (Universitat de Lleida, Universal Smart Cooling S.L.), Desideri Regany, Francesc X Majos, Manel Ibanez, Joan Ignasi Rosell, Josep Illa, Ferran Badia (Universitat de Lleida), Amrid Amnache, Etienne Leveille, Rajesh Pandiyan (Universite de Sherbrooke), Luc G Frechette (Universite de Sherbrooke, Universal Smart Cooling S.L.), Jerome Barrau (Universitat de Lleida, Universal Smart Cooling S.L.) |
MECHANICS & RELIABILITY Track
| PROF. AVRAM BAR-COHEN BEST PAPER | BEST PAPER – RUNNER UP |
| Novel Test Device for Non-destructive Experimental Characterization of Void Evolution in Microscale Solder Joints subjected to Thermal Aging | Impact of FEOL cross-heating on the thermal performance of advanced BEOL |
| Sudarshan Prasanna Prasad, Chetan Jois, Ganesh Subbarayan (Purdue University) | Melina Lofrano, Bjorn Vermeersch, Herman Oprins, Seongho Park, Zsolt Tokei (Imec) |
EMERGING TECHNOLOGIES & FUNDAMENTALS TRACK
| PROF. AVRAM BAR-COHEN BEST PAPER | BEST PAPER – RUNNER UP |
| Chip-level Thermal Simulation for a Multicore Processor Using a Multi-Block Model Enabled by Proper Orthogonal Decomposition | Pulsating Heat Pipe Fin Plates for Enhancing Natural and Forced Convection Cooling of Electronics: Experimental Campaign |
| Lin Jiang, Anthony Dowling, Yu Liu, Ming- Cheng Cheng (Department of Electrical And Computer Engineering Clarkson University) | Gautier Rouaze, Jackson Marcinichen, John Thome (JJ Cooling Innovation SARL), Kangnin Xiong, Winston Zhang (Novark Technologies) |