IEEE Intersociety Thermal and Thermomechanical Conference

IEEE ITHERM CONFERENCE



ITherm Sponsors and Exhibitors


Opportunities for Contributors


ITherm provides an opportunity for industrial and university participation in the form of financial support to ITherm 2017. Donations can be made to support the overall conference itself, for supporting specific events, and support for student travel grants. All contributors will be given strong recognition both onsite and in the conference materials.

To discuss opportunities for supporting ITherm, please contact Joshua Gess, +1-541-737-7034.

Become a Sponsor for ITherm 2017 in Orlando!

Gold Sponsor: $5,000 +

  • 6' table to distribute flyers/materials in the Foyer
  • 2 Complimentary Registrations to the ITherm conference
  • Access to student resumes participating in the student poster competition
  • 1 Full Page Acknowledgment as a Gold Sponsor in the Final Program
  • 2 Pages of promotional materials distributed at registration and integrated into the USB stick Proceedings, with a link to your corporate website
  • Acknowledgment on the conference website with a link to your corporate website
  • Signage throughout the conference venue acknowledging you as a Gold sponsor. Specific areas include: Hotel Lobby, Registration, General Session, and all Food Functions and Special Events

Silver Sponsor: $3,000 +

  • 1 Complimentary Registration to the ITherm conference
  • 1 Half Page Acknowledgment as a Silver Sponsor in the Final Program
  • 1 Page of promotional materials distributed at registration and integrated into the USB stick Proceedings, with a link to your corporate website
  • Acknowledgment on the conference website with a link to your corporate website
  • Signage throughout the conference venue acknowledging you as a Silver Sponsor. Specific areas include: Hotel Lobby, Registration, General Session, and all Food Functions and Special Events

Exhibitor: $3,000 +

  • 8'x 8' space to setup booth
  • 6' table to distribute flyers/materials in the Foyer
  • Two free exhibitor pass (not eligible for conference sessions, breakfast and lunch)
  • 25% discount on full registration (limited to 3 persons affiliated with the company, eligible for conference sessions, breakfast and lunch)
  • 1 Half Page Acknowledgment as an Exhibitor in the Final Program
  • 1 Page of promotional materials distributed at registration and integrated into the USB stick Proceedings, with a link to your corporate website
  • Acknowledgment on the conference website with a link to your corporate website
  • Signage throughout the conference venue acknowledging you as an Exhibitor. Specific areas include: Hotel Lobby, Registration, General Session, and all Food Functions and Special Events

Program Sponsor: $1,000

  • 1 Half Page Acknowledgment as a Program Sponsor in the Final Program
  • 1 Page of promotional materials distributed at registration and integrated into the USB stick Proceedings, with a link to your corporate website
  • Acknowledgment on the conference website and conference emails with a link to your corporate website

OUR GOLD SPONSORS :




OUR SILVER SPONSORS :




OUR PARTNERS :



Therminic
Therminic

THERMINIC is the major European Workshop related to thermal issues in electronic components and systems. For academics and industrialists involved in both micro and power electronics this event promises to be a very special occasion with a high quality technical program and an exciting social event.



OUR EXHIBITORS :


Innovative Research, LLC

Innovative Research, LLC

MacroFlowTM – A Software Tool for Rapid Thermal Design of Electronics Cooling Systems
MacroFlow is an easy-to-use software tool based on the Flow Network Modeling (FNM) technique for rapid and accurate system-level thermal design. MacroFlow has an intuitive GUI, an extensive library of components with built-in correlations and vendor data, a powerful solution methodology, and comprehensive capabilities for examining results. Use of MacroFlow for flow and thermal design results in substantially shorter design cycles. It is widely used for the design of air- and liquid-cooling systems in computer, telecom, defense, data center, and semiconductor processing applications.


Stšubli North America

Stšubli

Stšubli’s quick-release couplings contribute to an improved cooling circuit from the main supply to the various racks. Staubli technology ensures the optimum sealing of your circuits. The all-metallic flush-face connectors enable non-spill connections and disconnections with complete safety throughout the processes. With Stšubli solutions, the link between cooling liquids and electronics improves overall performance. Whatever the application, the fluid composition, or the circuit configuration, Stšubli provides a solution to fit your needs.




The ITherm/ECTC exhibits will be open on Wednesday June 1, from 9:00 AM – Noon and 1:30 PM – 6:30 PM; and again on Thursday June 2, 9:00 AM – Noon and 1:30 PM – 4:00 PM.
We are pleased to welcome these exhibitors with specific focus on thermal design/modeling/practice.

Review all 100+ Exhibitors who’ll be at ITherm/ECTC in Orlando (For a full list of exhibitors, and an Exhibitor Packet, please visit www.ectc.net/exhibitors).




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