IEEE Intersociety Thermal and Thermomechanical Conference

IEEE ITHERM CONFERENCE



Program


We are pleased to announce that there are 40 sessions and 216 technical papers for this year's ITherm Conference. Please see the ITherm 2017 Advance Program.

We also call your attention to the Keynotes, Technology Talks, Panels, Student Poster Session, and Professional Development Courses at the Conference. We promise you a week full of information and interactions that will enhance your knowledge and career.

This year, we also include new formats, such as 16 Invited Talks, including summaries from THERMINIC 2016 and EPTC 2016; Art-in-Science; and a Women & Underrepresented Achievers Panel, to make ITHERM even more exciting. Additional details of the conference program include:

KEYNOTES

  • Future for STEM Education & Research, G. P. "Bud" Peterson, Georgia Tech
  • Recent Advances and New Trends in Semiconductor Packaging, John H. Lau, ASM Pacific Technology Ltd.
  • Scalable Quantum Computing with Superconducting Qubits, Stefan Filipp, IBM Research
G. P. 'Bud' Peterson

G. P. "Bud" Peterson
Georgia Tech
John H. Lau

John H. Lau
ASM Pacific Technology Ltd.
Stefan Filipp

Stefan Filipp
IBM Research - Zurich

INVITED TALKS

  • Integrated Photonic Networks for Data Centers, Michael Haney, ARPA-e
  • The Journey toward flexible thermal superconductors, Sung Jin Kim, KIST
  • Highlights and trends from EPTC 2016, Ranjan Rajoo, GLOBALFOUNDRIES
  • Highlights and trends from THERMINIC 2016, Christopher Bailey, University of Greenwich
  • +12 more Invited Speakers selected from outstanding papers from the tracks

WOMEN AND DIVERSITY ACHIEVERS PANEL - More Info Here


SESSION TITLES FOR ITHERM 2017

Thermal - I: Component-Level
  • Air Cooling, Fans, & Heat Exchangers
  • Microgap Cooling & Evaporation/Condensation
  • Thermal Materials & Thermoelectrics
  • Pulsating/Oscillating & Nonconventional Heat Pipes
  • Heat Pipes & Thermosyphons
  • 3D Packaging & Embedded Cooling
  • Vapor Chambers & Passive Cooling
  • Hotspot & Impingement Cooling
  • Embedded Microfluidic Cooling
  • Single/Multi-Chip Module & System in Package
  • Flow Boiling & Two-Phase Cold Plates
  • Single-Phase Liquid Cold Plates & Heat Exchangers
Thermal - II: System-Level
  • Novel Technologies& CFD Techniques for Data Center Cooling
  • Data Center & Energy Efficiency I
  • Data Center & Energy Efficiency II
  • Automotive / RF Electronics / Power Electronics
  • LEDs Thermal Management
  • Session: Mobile / Internet of Things
  • LEDs /Battery Thermal Management
  • Data Center System Analysis & Control Methodologies
  • Immersion Coolingg
Mechanics & Reliability
  • Thermal-Mechanical Interaction in Microelectronics Package & System I
  • Thermal-Mechanical Interaction in Microelectronics Package & System II
  • Mechanics in Assembly & Packaging I
  • Mechanics in Assembly & Packaging II
  • Solder Characterization & Modeling
  • Solder Reliability
  • Applied Reliability
  • Modeling & Finite Element Technique
Emerging Technologies & Fundamentals
  • Nanotechnology
  • Emerging Materials & Thermal Phenomenon I
  • Emerging Materials & Thermal Phenomenon II
  • Thermal Interface & Phase Change Materials I
  • Thermal Interface & Phase Change Materials II
  • Thermal Numerical Methods I
  • Thermal Numerical Methods II
  • Thermal Experimental Methods
  • Fundamentals of Convection in Channels & Jets
  • Fundamentals on Boiling & Condensation
  • Fundamentals of Thermal Transport & Transistor Technology

DISTINGUISHED CONTRIBUTIONS THIS YEAR

Keynotes
  • Future for STEM Education & Research
  • Recent Advances and New Trends in Semiconductor Packaging
  • Scalable Quantum Computing with Superconducting Qubits
Special Activities
  • Student Poster Session
  • Art-in-Science
  • Women & Underrepresented Achievers Panel
Technology Talks
  • Additive Manufacturing in Heat Transfer
  • Transient Thermal Management
  • Data Center Thermal Management
  • Aerospace Thermal Management
  • 3D Thermal Management
  • GaN Device Cooling
Panel Topics
  • Micro 2-Phase Liquid Cooling
  • IoT Thermal Management
  • Mobile Device Thermal / Mechanical Challenges
  • Health Care Thermal Management
  • Data Center Thermal Management
  • Novel Materials and Fabrication

INVITED TALKS & PAPER PRESENTATIONS

  • Highlights and trends from EPTC 2016
  • Highlights and trends from THERMINIC 2016
  • Integrated Photonics for Data Centers
  • The Journey toward Flexible Thermal Superconductors
  • +12 more Invited Speakers selected from outstanding papers from the tracks

Professional Development Courses
(ITherm/ECTC)

  • Integrated Thermal Packaging and Reliability of Power Electronics
  • Thermo-Electric Coolers: Characterization, Reliability, and Modeling
  • Thermo-Electrical Co-Design for 3D Integration
  • Plus.... 15 More Courses on a Variety of Topics




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