IEEE Intersociety Thermal and Thermomechanical Conference


Welcome to ITHERM 2017
The Intersociety Conference on Thermal and
Thermomechanical Phenomena in Electronic Systems

May 30 - June 2, 2017

2017 | Walt Disney World Swan and Dolphin Resort, Orlando, United States

(Co-Located with ECTC)

Please download the Full Final Program today. Registration is now open; once you are registered, we can provide a Visa Interview letter, to assist in your travels to the USA.

Sponsored by the IEEE's CPMT Society, ITherm 2017 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. ITherm 2017 will be held along with the 66th Electronic Components and Technology Conference (ECTC 2017 -, a premier electronics packaging conference. Dual-registration for ITHERM and ECTC is offered at a substantial discount. In addition to Oral and poster presentations and vendor exhibits, ITherm 2017 includes panel discussions, keynote lectures by prominent speakers, a "Cutting Edge Vendors" session, a Workshop on the Industrial Internet, and professional short courses.

We invite you to register for ITherm 2017. You may register on our Cvent website, , now open. Early Bird Rates include a $100 discount and are valid through April 30, 2017. More details on our Registration Page.

Important Dates:

Deadline for Abstracts September 16, 2016
Notification of Acceptance September 30, 2016
Draft Paper Submission (Extended) January 16, 2017
Reviews Returned February 6, 2017
Final Paper Submission March 13, 2017
Author Registration Deadline April 17, 2017
Early Bird Registration Deadline April 30, 2017
Hotel Room Block Reservation Cut-Off May 5, 2017
ITherm Conference Begins May 30, 2017

To receive periodic announcements about ITHERM, please join our IEEE ListServ Dlist. You may also join by email: with this information in the BODY: subscribe ieee-itherm FirstName LastName.

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