Please download the Full Advance Program today.
Registration is now open; once you are registered, we can provide a Visa Interview letter,
to assist in your travels to the USA.
Sponsored by the IEEE's CPMT Society, ITherm 2017 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. ITherm 2017 will be held along with the 66th Electronic Components and Technology Conference (ECTC 2017 - http://www.ectc.net), a premier electronics packaging conference. Dual-registration for ITHERM and ECTC is offered at a substantial discount. In addition to Oral and poster presentations and vendor exhibits, ITherm 2017 includes panel discussions, keynote lectures by prominent speakers, a "Cutting Edge Vendors" session, a Workshop on the Industrial Internet, and professional short courses.
We invite you to register for ITherm 2017. You may register on our Cvent website, www.cvent.com/d/2fq1ck , now open. More details on our Registration Page.
|Deadline for Abstracts||September 16, 2016|
|Notification of Acceptance||September 30, 2016|
|Draft Paper Submission (Extended)||January 16, 2017|
|Reviews Returned||February 6, 2017|
|Final Paper Submission||March 13, 2017|
To receive periodic announcements about ITHERM, please join our IEEE ListServ Dlist. You may also join by email: firstname.lastname@example.org with this information in the BODY: subscribe ieee-itherm FirstName LastName.